The flying probe test is a circuit board test method used to detect process defects and functions during the production of circuit boards. In flying probe test, the probe moves on the circuit board at high speed and performs contact test on each test point. This test method does not require the use of traditional test fixtures, so the cost is relatively low. Since flying probe does not rely on test points, it can improve test coverage by contacting the pads of components, which is very different from traditional ICT.

Flying probe test can effectively detect short circuits, open circuits, electrical characteristics and connectivity of various components on the circuit board, and can perform simple functional tests on the circuit board. It is widely used in the electronics manufacturing industry, especially in prototype manufacturing and small batch production.

In general, flying probe test is a commonly used circuit board test method that can effectively perform connectivity and functional tests to ensure the quality and performance of circuit boards.