JT - Therlicon TRS Series Semiconductor Packaging Reflow Oven - MTSC Solution Sdn. Bhd.

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JT - Therlicon TRS Series Semiconductor Packaging Reflow Oven

Features:

In-line type vacuum assisted reflow oven
High efficiency, no void, low maintenance
Independent temperature control, allowing flexible profile
Bubble and void issues solved, 1% void can be achieved
Equipped with high efficiency vacuum pump for quick pressure reduction
3-section conveyor: Heating, vacuum & cooling zone (Individual adjustment)
High production output
Equipped with high efficiency flux collection system
Single lane oven: TRV-800-N, TRV-1000-N, TRV-1200-N
Dual lane oven: TRV-800D-N, TRV-1000D-N, TRV-1200D-N

Specifications

PCB length	150 - 300 mm
PCB width	Single lane oven: 100 - 400 mm // Dual lane oven: 100 - 250 mm x 2 OR 100 - 420 mm
Number of cooling zones	Top 3 & bottom 3 (Cool air convection)
Temperature setting range	Room temp. - 300°C (Vacuum zone: Max. 280°C)
Temperature control method	PID closed loop control + SSR driving
Temperature control accuracy	±1.0°C
Temperature deviation on PCB	±1.5°C (Based on JT board test standard)
Exhaust flowrate	15 m3/min x 2
Power supply	3 phase, 380V 50/60 Hz (Optional: 220V)

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