UIC - Semiconductor & Adv. Packaging - MTSC Solution Sdn. Bhd.

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Consumer, Automotive and IoT devices are getting smaller and thinner, 2.5D and SiP multi-die packages are becoming more complex, InFO and Panel Fan-Out are driving large-format batch processing, and volume demands are rising. These new challenges demand a comprehensive solution that breaks tradition ...Read more

UIC - Semiconductor & Adv. Packaging

Features:

Maximum die size range with thinnest die
Maximum panel size processing up to 635mm x 610mm on FuzionSC
14 high-precision (sub-micron X,Y,Z) servo-driven pick heads
High-precision (sub-micron X,Y,Z) servo-driven ejector

100% pre-pick vision and die alignment
One-step “wafer-to-placement” handoff
Synchronous wafer stretch and storage
16K cph dual wafer tables
Up to 52 unique wafers types at once; 100mm, 150mm, 200mm, 300mm

Details

The High-Speed Wafer Feeder (HSWF) meets these challenges head-on, delivering value with the precision, performance and flexibility to handle today’s most advanced applications, while also enabling you for those to come.