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JT - Therlicon TRS Series Semiconductor Packaging Reflow Oven

Features:

  • In-line type vacuum assisted reflow oven
  • High efficiency, no void, low maintenance
  • Independent temperature control, allowing flexible profile
  • Bubble and void issues solved, 1% void can be achieved
  • Equipped with high efficiency vacuum pump for quick pressure reduction
  • 3-section conveyor: Heating, vacuum & cooling zone (Individual adjustment)
  • High production output
  • Equipped with high efficiency flux collection system
  • Single lane oven: TRV-800-N, TRV-1000-N, TRV-1200-N
  • Dual lane oven: TRV-800D-N, TRV-1000D-N, TRV-1200D-N



  • Specifications
PCB length 150 - 300 mm
PCB width Single lane oven: 100 - 400 mm // Dual lane oven: 100 - 250 mm x 2 OR 100 - 420 mm
Number of cooling zones Top 3 & bottom 3 (Cool air convection)
Temperature setting range Room temp. - 300°C (Vacuum zone: Max. 280°C)
Temperature control method PID closed loop control + SSR driving
Temperature control accuracy ±1.0°C
Temperature deviation on PCB ±1.5°C (Based on JT board test standard)
Exhaust flowrate 15 m3/min x 2
Power supply 3 phase, 380V 50/60 Hz (Optional: 220V)
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