Vitrox - V810i S3 - MTSC Solution Sdn. Bhd.

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V810i S3 : Advanced 3D X-ray Inspection System (V810i S3)

Designed for various sizes of PCB assemblies to increase production efficiency and cost savings for Electronic Manufacturing Services (EMS), Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and etc.

System	V810i S3
System controller	Integrated controller with 8 Core Intel Xeon processors
Operating system	Windows 10 Pro (64 bit)
Test Development Environment
User interface	Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels
Off-line test development software	Optional for off-line PC
CAD conversion tool	Support 4 different types of CAD in V810i software and optional software available to translate other CAD data to ViTrox's format
Typical test development time	4 hours to 1.5 days to convert raw CAD file and develop application
Line Integration
Transport heights	865mm-1025mm
Line communication standard	SMEMA, HERMES
Barcode readers	Compatible with most industry standard barcode readers
Performance Parameters *
False Call rate	500-1000ppm
Minimum features detection capability
Joint pitch1	0.3mm and above
Short width2	0.045mm
Solder thickness	0.0127mm
Allowable Panel Characteristics **	V810i S3
Maximum PCB Size (L x W)	725mmx482.6mm (28.5"x19")
Minimum PCB Size (L x W)	63.5mmx63.5mm (2.5"x 2.5")
Maximum PCB inspectable area	725mmx474.9mm (28.5"x18.7")
Maximum PCB thickness	7mm (276 mils)
Minimum PCB thickness	0.5mm (20 mils)
PCB warp	Downside 3.3mm; Upside 3.3mm
Maximum PCB weight	4.5kg
Top Clearance of PCB	50mm @ 22μm resolution 42mm @ 19μm resolution 26mm @ 15μm resolution 11mm @ 12μm resolution 26mm @ 10μm resolution 11mm @ 7μm resolution (calculated from board top surface)
Bottom Clearance of PCB	80mm
PCB edge clearance	3mm
100% Press-fit testability	Yes (With PSP2 / PSP2.1 feature)
PCB Temperature	40℃