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V310i SE : Advanced 3D Solder Paste Inspection (SPI)The best value SPI solution with AI Ultra Smart programming. ...Read more
Vitrox - V310i SE


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  • Specifications

V310i SE : Advanced 3D Solder Paste Inspection (SPI)


The best value SPI solution with AI Ultra Smart programming.

System V310i SE
System Performances  
Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge.
Board Level Traceability Camera-Read Barcodes; External Barcode Reader Configured
System Hardware 12MP 4MP
Operating System Windows 10 (64 bit)
Optical Resolution & FOV Size * Default: 60mmx45mm @ 15µm telecentric lens
Option: 52mmx39mm @ 13µm telecentric lens
Option: 40mmx30mm @ 10µm telecentric lens
Option: 32mmx24mm @ 8µm telecentric lens
Default: 40mmx40mm @ 20µm telecentric lens
Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec

12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec
4MP CameraLink @ 20µm Resolution: Up to 55 cm²/sec
3D Technologies Phase Shift Profilometry (PSP) Methodology
Lighting Module Concurrent RGB Lighting Module
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB Dimension Standard FDL
Maximum PCB Size (L x W) 620mmx690mm (24.4”x27.2”)

Option:
1200mmx690mm (47.2”x27.2”)
DL Equal: 620mmx325mm (24.4”x12.8”)
Single Lane: 620mmx600mm (24.4”x23.6”)
Minimum PCB Size (L x W) 50mmx50mm (2”x2”) 50mmx50mm (2”x2”)
Maximum PCB Inspectable Area (L x W) 620mmx683mm (24.4”x26.9”)

Option:
1200mmx683mm (47.2”x26.9”)
DL Equal: 620mmx318mm (24.4”x12.5”)
Single Lane: 620mmx593mm (24.4”x23.3”)
Maximum PCB Thickness 15mm (0.59") 8mm (0.31")
Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02")
Maximum PCB Weight 7kg (Option: 15kg) 7kg
Top Clearance of PCB 50mm 50mm
Bottom clearance of PCB 100mm 100mm
PCB Edge Clearance 3.5mm 3.5mm
PCB Transport Height 890mm-965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
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