Vitrox - V310i SE - MTSC Solution Sdn. Bhd.

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V310i SE : Advanced 3D Solder Paste Inspection (SPI)

The best value SPI solution with AI Ultra Smart programming.

System	V310i SE
System Performances
Inspection Functions	Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge.
Board Level Traceability	Camera-Read Barcodes; External Barcode Reader Configured
System Hardware	12MP	4MP
Operating System	Windows 10 (64 bit)
Optical Resolution & FOV Size *	Default: 60mmx45mm @ 15µm telecentric lens Option: 52mmx39mm @ 13µm telecentric lens Option: 40mmx30mm @ 10µm telecentric lens Option: 32mmx24mm @ 8µm telecentric lens	Default: 40mmx40mm @ 20µm telecentric lens
Inspection Speed	12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec	4MP CameraLink @ 20µm Resolution: Up to 55 cm²/sec
3D Technologies	Phase Shift Profilometry (PSP) Methodology
Lighting Module	Concurrent RGB Lighting Module
Conveyor Width Adjustment	Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB Dimension	Standard	FDL
Maximum PCB Size (L x W)	620mmx690mm (24.4”x27.2”) Option: 1200mmx690mm (47.2”x27.2”)	DL Equal: 620mmx325mm (24.4”x12.8”) Single Lane: 620mmx600mm (24.4”x23.6”)
Minimum PCB Size (L x W)	50mmx50mm (2”x2”)	50mmx50mm (2”x2”)
Maximum PCB Inspectable Area (L x W)	620mmx683mm (24.4”x26.9”) Option: 1200mmx683mm (47.2”x26.9”)	DL Equal: 620mmx318mm (24.4”x12.5”) Single Lane: 620mmx593mm (24.4”x23.3”)
Maximum PCB Thickness	15mm (0.59")	8mm (0.31")
Minimum PCB Thickness	0.5mm (0.02")	0.5mm (0.02")
Maximum PCB Weight	7kg (Option: 15kg)	7kg
Top Clearance of PCB	50mm	50mm
Bottom clearance of PCB	100mm	100mm
PCB Edge Clearance	3.5mm	3.5mm
PCB Transport Height	890mm-965mm
PCB Temperature	Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.