Vitrox - V310i XL - MTSC Solution Sdn. Bhd.

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V310i XL : Advanced 3D Solder Paste Inspection (SPI)

The V310i XL SPI system is a new launch solder paste vision platform integrated with Z-Height feature to maximize large board size inspection.

System	V310i XL
System Performances
Inspection Functions	Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge.
Board Level Traceability	Camera-Read Barcodes; External Barcode Reader Configured
System Hardware	12MP	4MP
Operating System	Windows 10 Pro (64 bit)
Optical Resolution & FOV Size	Default: 60mmx45mm @ 15µm telecentric lens Option: 53mmx39mm @ 13µm telecentric lens Option: 32mmx24mm @ 8µm telecentric lens	Default: 40mmx40mm @ 20µm telecentric lens
Inspection Speed	12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec"	4MP CameraLink @ 20µm Resolution: Up to 55 cm²/sec
3D Technologies	Phase Shift Profilometry’s (PSP) Methodology
Lighting Module	Concurrent Lighting Module
Conveyor Width Adjustment	Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB Dimension	XL SL	XL FDL
Maximum PCB Size (L x W)	460mmx690mm (18.1''x27.2'')	DL Equal: 460mmx325mm (18.1''x12.8'') Single Lane: 460mmx600mm (18.1''x23.6'')
Minimum PCB Size (L x W)	50mmx50mm (2”x2”)	50mmx50mm (2”x2”)
Maximum PCB Inspectable Area (L x W)	460mmx683mm (18.1''x26.8'')	DL Equal: 460mmx318mm (18.1''x12.5'') Single Lane: 460mmx593mm (18.1''x23.3'')
Maximum PCB Thickness	7mm (0.27")	7mm (0.27")
Minimum PCB Thickness	0.5mm (0.02")	0.5mm (0.02")
Maximum PCB Weight	3kg	3kg
Top Clearance of PCB	50mm	50mm
Bottom clearance of PCB	100mm	100mm
PCB Edge Clearance	3.5mm	3.5mm
PCB Transport Height	875mm-965mm
PCB Temperature	Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.