Manufacturing Process Improvement SMT Assembly Process

• Board depanelization (routing) processes
• All rework handling processes
• Connector Installation
• Component Installation

Shipping Environment

• Shock and Vibration Test
• Drop Testing Test

Manufacturing Process Improvement Mechanical Assembly

• Heat Sink Assembly
• Board Support/Stiffener Assembly
• System Board Integration or System Assembly

Board Test Processes

• In-Circuit Test (ICT)
• Board Functional Test or equivalent Functional Test

Sofware Features

• User-Friendly Software with One-touch report generation function
• Data Analysis as Diagonal Strain, Max/Min Principle Strain, Strain Rate, QStrain .
• Allow to setup software on different computers.